CVD 150
Independently developed 6-inch (downward compatible with 4-inch ) plasma enhanced chemical vapor deposition (PECVD) equipment.
相關(guān)產(chǎn)品
Product Features
1. Based on the thin film deposition scheme of silane system, TEOS and boron phosphorus doping process requirements can be selected;
2. Dual frequency RF system, wider profit adjustment range;
3. Millisecond precise parameter control, with high process control accuracy;
4. The operating system is a software control system developed based on Windows and conforms to semiconductor standard, which is user-friendly and in line with the operating habits of Chinese people;
5. Fully automatic wafer processing;
6. The equipment covers a small area and the site utilization rate is high;
7. Downward compatible with 4-inch Wafer;
Application Fields
Third generation semiconductors, power semiconductors, and LED chip manufacturing fields.
